Rogers RO4350B High Frequency Board

Rogers RO4350B High Frequency Board

Name: Rogers RO4350B High Frequency Board

Material: Rogers RO4350B

Layer: 2L

DK: 3.48

Dielectric Thickness: 0.762mm

Thermal Conductivity: 0.69w/m.k

Flammability: 94V-0

Volume Resistivity: 1.2*1010

Surface Resistivity: 5.7*109

Finished Thickness: 0.8MM

Copper Thickness: Base 0.5OZ, Finished 1OZ

Product Details Data Sheet

ntroducing the Rogers RO4350B High-Frequency Board, a specialized circuit board designed to meet the stringent requirements of high-frequency applications. Engineered with the industry-leading RO4350B material from Rogers Corporation, this board offers exceptional electrical performance, low signal loss, and also reliable high-frequency capabilities.

The key feature of the Rogers RO4350B High-Frequency Board is its utilization of the RO4350B laminate material. RO4350B is a high-frequency, low-loss thermoset material known for its outstanding electrical properties. With a low dielectric constant (Dk) of 3.48 and a low dissipation factor (Df) of 0.0037 at 10 GHz, this material ensures minimal signal loss, superior signal integrity, and accurate transmission of high-frequency signals.

The RO4350B High-Frequency Board delivers excellent performance in high-frequency applications. It maintains a controlled impedance, which is crucial for maintaining signal integrity and preventing reflections that can degrade system performance. This makes the board well-suited for applications such as wireless communication systems, radar systems, microwave devices, and also high-speed digital circuits.

The low-loss characteristic of the RO4350B material ensures minimal signal attenuation, allowing for efficient signal transmission and reducing the risk of signal distortion. This enables the board to handle high-frequency signals with precision, resulting in improved system performance and data integrity.

Additionally, the RO4350B High-Frequency Board offers excellent thermal properties. It has a high thermal conductivity of 0.8 W/mK, enabling effective heat dissipation and minimizing the impact of thermal issues on high-frequency performance. This thermal management capability ensures the reliability and also stability of the board, even under demanding operating conditions.

Name: Rogers RO4350B High Frequency Board

Material: Rogers RO4350B

Layer: 2L

DK: 3.48

Dielectric Thickness: 0.762mm

Thermal Conductivity: 0.69w/m.k

Flammability: 94V-0

Volume Resistivity: 1.2*1010

Surface Resistivity: 5.7*109

Finished Thickness: 0.8MM

Copper Thickness: Base 0.5OZ, Finished 1OZ

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