DIP plug-in processing

DIP Plug-in Processing Manufacturer – SMT Patch

Name: DIP Plug-in Processing Manufacturer – SMT Patch
Origin: China
Certified: UL, CE, RoSH
Board Thickness: 1.6mm
Copper Thickness: 1 oz
Solder mask: White
Surface Finishing
lead free hasl, OSP, Immersion Gold, Immersion Tin

PCB Textolite SMT drone receiver board raspberry

Name: PCB Textolite SMT drone receiver board raspberry
Origin: China
Certified: UL, CE, RoSH
Board Thickness: 1.0-1.6mm
Copper Thickness: 1 oz, 1-12OZ
Surface Finishing: OSP/HASL/Immersion Gold
Number of Layer: 1-16 layers

DIP Plug-in Processing Medical device-Leadsintec

Name: DIP Plug-in Processing Medical device-Leadsintec
Origin: China
Certified: UL, CE, RoHS
Application: Electronics Device
Layer: 2 layers
Board Thickness: customized
Copper Thickness: 1 oz

PCB And SMT DIP Plug-in Processing Electronic Components Assembly

Name: PCB And SMT DIP Plug-in Processing Electronic Components Assembly
Origin: China
Certified: UL, CE, RoHS
Surface Finishing: lead free hasl
Copper Thickness: 3 oz
Material: FR4
Board Thickness: customized
Solder mask: White

The DIP (Dual In-Line Package) plug-in processing solution is a versatile and efficient method for integrating electronic components onto printed circuit boards (PCBs). This plug-in processing technique allows for easy insertion and removal of components into DIP sockets on the PCB, offering a flexible and modular approach to electronic assembly.

The DIP plug-in processing solution involves the use of DIP packages, which consist of individual electronic components encapsulated in rectangular-shaped housings with two parallel rows of pins. These pins are designed to fit into corresponding sockets on the PCB, creating a reliable and secure electrical connection.

With DIP electronic components such as integrated circuits (ICs), resistors, capacitors, and other discrete devices can be conveniently mounted onto the PCB without the need for complex soldering processes. Instead, the components are inserted into the DIP sockets, allowing for easy replacement or reconfiguration as needed.

Advantages of DIP Plug-in Processing:

  1. Versatility and Modularity: DIP processing provides a high level of versatility and modularity in electronic assembly. Components can be easily plugged in or removed from DIP sockets, facilitating rapid prototyping, testing, and system modifications. This flexibility also allows for efficient design iterations and simplifies maintenance and repairs.
  2. Time and Cost Efficiency: The plug-in nature of DIP processing significantly reduces the time and cost associated with assembly and rework. The absence of soldering eliminates the need for specialized soldering equipment, reducing setup and labor costs. Additionally, the ability to quickly replace faulty components improves repair turnaround time and minimizes downtime.
  3. Accessibility for Testing and Debugging: DIP processing provides easy access to components for testing and debugging purposes. During the development phase, engineers can quickly insert or remove components to assess their functionality and troubleshoot any issues. This accessibility aids in the efficient identification and resolution of problems, reducing development cycles.
  4. Component Compatibility and Interchangeability: DIP packages offer broad compatibility with various electronic components. The standardized pin configurations and socket layouts ensure compatibility across a wide range of ICs and discrete devices. This interchangeability simplifies component sourcing, inventory management, and system upgrades.
  5. High Connection Reliability: DIP sockets provide reliable electrical connections between components and PCBs. The pins and sockets are designed to create secure contacts, ensuring consistent and robust signal transmission. This reliability is crucial for maintaining signal integrity and also minimizing the risk of loose connections or intermittent faults.


Item Process Capability Parameter
Order Quantity ≥1PC
Quality Grade IPC-A-610
Lead Time 24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you.
Size 50*50mm~510*460mm
Board Type Rigid PCB, Flexible PCB, metal core PCB
Min Package 01005 (0.4mm*0.2mm)
Max Package No limit
Mounting Accuracy ±0.035mm(±0.025mm)  Cpk≥1.0 (3σ)
Surface Finish Lead/Lead-free HASL, Immersion gold, OPS, etc.
Assembly Types Surface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole)
Component Sourcing Turnkey (All components sourced by PCBMay), Partial turnkey, Kitted/Consigned
BGA Package BGA Dia. 0.14mm, BGA 0.2mm pitch
SMT Parts Presentation Cut Tape, Partial reel, Reel,Tube, Tray, Laser-cut Stainless Steel
Cable Assembly We supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical and entertainment.
Stencil Stencil with or without frame (offered free by PCBMay)
Quality Inspection Visual inspection; AOI checking; BGA placement – X-RAY checking
SMT Capacity 3 Million~4 Million Soldering Pad/day
DIP Capacity 100 Thousand Pins/day

Automatic Solder Paste Printing Machine


AOI Optical Inspection


Smt High-Speed Placement Machine


Nitrogen Reflow Soldering




Three Anti-Paint Spraying Machine


SPI Solder Paste Thickness Tester


Automatic Wave Soldering Machine


First Article Inspection

SMT capacity: 19 million points/day
Testing Equipment X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed Chip placement speed (at best conditions) 0.036 S/piece
Mounted Component Specifications Pasteable smallest package
Minimum device accuracy
IC type chip accuracy
Mounted PCB Specifications Substrate size
Substrate thickness
throw rate 1. Resistance-capacitance ratio 0.3%
2. IC type without throwing material
Board Type POP/common board/FPC/rigid-flex board/metal substrate
DIP daily production capacity
DIP plug-in production line 50000 points/day
DIP post welding production line 20000 points/day
DIP test production line 50000pcs PCBA/day
Assembly processing capability
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month
PCBA processing capability
project Mass processing capability Small batch processing capability
Number of layers (max) 2-18 20-30
Plate type FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet PTFE, PPO, PPE
Rogers,etc Teflon E-65, ect
Sheet mixing 4 layers – 6 layers 6th floor – 8th floor
biggest size 610mm X 1100mm /
Dimensional Accuracy ±0.13mm ±0.10mm
Plate thickness range 0.2mm–6.00mm 0.2mm–8.00mm
Thickness tolerance ( t≥0.8mm) ±8% ±5%
Thickness tolerance (t<0.8mm) ±10% ±8%
Media thickness 0.076mm–6.00mm 0.076mm–0.100mm
Minimum line width 0.10mm 0.075mm
Minimum spacing 0.10mm 0.075mm
Outer copper thickness 8.75um–175um 8.75um–280um
Inner layer copper thickness 17.5um–175um 0.15mm–0.25mm
Drilling hole diameter (mechanical drill) 0.25mm–6.00mm 0.15mm–0.25mm
Hole diameter (mechanical drill) 0.20mm–6.00mm 0.10mm–0.20mm
Hole Tolerance (Mechanical Drill) 0.05mm /
Hole tolerance (mechanical drill) 0.075mm 0.050mm
Laser Drilling Aperture 0.10mm 0.075mm
Plate thickness aperture ratio 10:1 12:1
Solder mask type Photosensitive green, yellow, black, purple, blue, ink /
Minimum Solder Mask Bridge Width 0.10mm 0.075mm
Minimum Solder Mask Isolation Ring 0.05mm 0.025mm
Plug hole diameter 0.25mm–0.60mm 0.60mm-0.80mm
Impedance tolerance ±10% ±5%
Surface treatment type Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board Immersion Tin, OSP

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