Introducing our high-Tg (glass transition temperature) PCBs, designed to withstand elevated temperatures and provide exceptional thermal stability in demanding applications. Our high-Tg PCBs are built using specialized materials that offer enhanced mechanical and thermal properties. This also ensures reliable performance in high-temperature environments.



Our high-Tg PCBs are ideal for applications that require resistance to high-temperature soldering processes, elevated operating temperatures, or exposure to thermal stress. Whether you’re working on automotive electronics, industrial equipment, aerospace systems, or any other high-temperature application, our high-Tg PCBs are a reliable choice.



Our high-Tg PCBs provide design flexibility, enabling the integration of complex circuit layouts and multi-layer structures. They support fine-pitch components, high-density interconnections, and controlled impedance designs.

Advantages of High-Tg PCB:

  1. Elevated Temperature Resistance: High-Tg PCBs are specifically engineered to withstand elevated temperatures beyond the capabilities of standard PCB materials. They exhibit a higher glass transition temperature, typically above 170°C. It also ensures dimensional stability and mechanical integrity even under extreme thermal conditions.
  2. Enhanced Thermal Performance: High-Tg PCBs offer superior thermal conductivity and dissipation properties. They efficiently transfer heat away from heat-generating components. This also prevent it from overheating and ensuring the reliable operation of sensitive electronic devices in high-temperature environments.
  3. Resistance to Thermal Stress: High-Tg PCBs are less susceptible to thermal stress and mechanical failures caused by temperature variations. Their robust construction and specialized materials minimize the risk of delamination, warping, and solder joint failures, even during repeated thermal cycling or exposure to rapid temperature changes.
  4. Compatibility with High-Temperature Soldering Processes: High-Tg PCBs are designed to withstand the high temperatures associated with lead-free and high-temperature soldering processes. These PCBs exhibit excellent solderability and resistance to solder joint cracking or thermal fatigue.
  5. Reliability in Harsh Environments: High-Tg PCBs offer increased reliability in harsh operating environments. They can endure extreme temperature variations, high humidity, and exposure to chemicals or corrosive substances.




Standard PCB Production Capability
Feature Capability
Quality Grade Standard IPC 2
Number of Layers 1 – 32layers
Order Quantity 1pcs – 10,000,000 pcs
Build Time 2days – 5weeks (Expedited Service)
Material FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, FR4-Halogen-free, FR4-Halogen-free & High-Tg
Board Size Min 6*6mm | Max 600*700mm
Board size tolerance ±0.1mm – ±0.3mm
Board Thickness 0.4mm – 3.2mm
Board Thickness Tolerance ±0.1mm – ±10%
Copper Weight 0.5oz – 6.0oz
Inner Layer Copper Weight 0.5oz – 2.0oz
Copper Thickness Tolerance +0μm +20μm
Min Tracing/Spacing 3mil/3mil
Solder Mask Sides As per the file
Solder Mask Color Green, White, Blue, Black, Red, Yellow
Silkscreen Sides As per the file
Silkscreen Color White, Blue, Black, Red, Yellow
Surface Finish HASL – Hot Air Solder Leveling
Lead Free HASL – RoHS
ENIG – Electroless Nickle/Immersion Gold – RoHS
ENEPIG – Electroless Nickel Electroless Palladium Immersion Gold – RoHS
Immersion Silver – RoHS
Immersion Tin – RoHS
OSP -Organic Solderability Preservatives – RoHS
Min Annular Ring 3mil
Min Drilling Hole Diameter 6mil, 4mil-laser drill
Min Width of Cutout (NPTH) 0.8mm
NPTH Hole Size Tolerance ±.002″ (±0.05mm)
Min Width of Slot Hole (PTH) 0.6mm
PTH Hole Size Tolerance ±.003″ (±0.08mm) – ±4mil
Surface/Hole Plating Thickness 20μm – 30μm
SM Tolerance (LPI) .003″ (0.075mm)
Aspect Ratio 1.10 (hole size: board thickness)
Test 10V – 250V, flying probe or testing fixture
Impedance tolerance ±5% – ±10%
SMD Pitch 0.2mm(8mil)
BGA Pitch 0.2mm(8mil)
Chamfer of Gold Fingers 20, 30, 45, 60
Other Techniques Gold fingers
Blind and Buried Holes
peelable solder mask
Edge plating
Carbon Mask
Kapton tape
Countersink/counterbore hole
Half-cut/Castellated hole
Press fit hole
Via tented/covered with resin
Via plugged/filled with resin
Via in pad
Electrical Test

PCB Drilling machine


PCB pattern plating line


PCB solder mask expose machine


PCB pattern expose machine


Strip film etching line


Solder mask screen silk print machine


Solder mask scrubbing line


PCB Flying Probe Test (FPT)


Fully automatic exposure machine

Why choose us?
competitive price

We have the most competitive price, our own factory, reasonable cost control, no hidden cost

No order threshold

Without any minimum order restrictions, provide high-performance PCBs in the shortest time

24-hour customer service

we provide 24-hour service and support, you will receive a reply to your question within 2 hours and a quotation within 24 hours.

Free DFM service

Before the official production of the PCB, we will conduct a free DFM review service and support free Allegro, Altium, Protel, PADS, OBD, Gerber and other formats.

1. What is the difference between high TG and general TG materials?
The general TG plate is more than 130 degrees, the high TG is generally greater than 170 degrees, and the medium TG is about 150 degrees.
2. What are the advantages of high TG PCB?
Higher stability, best to withstand high power density designs, ideal for multilayer and HDI PCBs.
3. What is a high Tg PCB material?
The circuit board material must be flame retardant, cannot burn at a certain temperature, but can only soften. This temperature point is called the glass transition temperature (Tg). A higher Tg point means higher temperature requirements during lamination.
4. What is Tg in PCB?
Tg, or glass transition temperature, is a basic material parameter of temperature (°C). It defines the temperature at which the substrate becomes mechanically unstable. Tg is the temperature value that guarantees the mechanical stability of the PCB during the life of the PCB.

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