BGA Assembly

BGA Assembly

BGA PCB SMT Assembly Electronics

BGA PCB SMT Assembly Electronics PCBA EMS Service

Number of Layer:1,2,4 or 6,upto 18 layer
Order Quantity:1 to 50,000
Board Shape:Retangular,round,slots,cutouts,complex,irregular
Board Type:Rigid, Flexible, Rigid-flexible
Board Material:FR-4 glass epoxy, FR-4 high Tg, Rohs compliant,Aluminum,Rogers,etc.
Board Cutting:Shear,V-score,Tab-routed
Board Thickness:0.2-4.0mm, Flex 0.01-0.25mm
Copper Weight:1.0, 1.5, 2.0 oz
Solder Mask:Double-sided green LPI,Also support Red,White,Yellow,Blue,Black
Silk Screen:Double-sided or single-sided in white,yellow,black,or negative
Silk Screen Min Line Width:0.006” or 0.15mm
Max Board Dimensions:20 inch*20inch or 500mm*500mm
Min Trace/Gap:0.10mm, or 4mils
Min Drill Hole Diameter:0.01”,0.25mm, or 10mils
Surface Finish:HASL,Nickle,Immersion Gold,Immersion Tin,Immersion Silver,OSP,etc.
Board Thickness Tolerance:±10%
Copper Weight Tolerance:± 0.25 oz
Minimal Slot Width:0.12”, 3.0mm, or 120mils
V-Score Depth:20-25% of board thickness
Design File Formate:Gerber RS-274,274D,Eagle and AutoCAD’s DXF,DWG

BGA Assembly for Pulse Oximeter

BGA PCB Assembly Factory Manufacture For Pulse Oximeter PCB PCBA one-stop Service

Product Name: PCB Assembly Service
Type: Rigid
Material:FR4, CEM1, CEM3, High Frequency Board,Rogers
Shape: Rectangular, Round, Slots, Cutouts, Complex, Irregular
Cutting Shear, V-score, Tab-routed
Board Thickness 0.2-4mm, regular 1.6mm
Copper Thickness:0.5-4oz, regular 1oz
Solder Mask: Green, Red, Blue, Yellow, etc.
Silk Screen: White, Black, etc.
Silk Screen Min Line Width:0.006″ or 0.15mm
Min Trace/Gap:0.1mm or 4mils
Min Drill Hole Diameter 0.01″,0.25mm or 10mils
Surface Finish HASL, ENIG, OSP, etc.

Module BGA Assembly

Module ARM Cortex A7 i.MX6 SOM Module BGA Assembly use in IoT Gateway

Name: BGA Assembly

CPU:: ARM Cortex A53 Quad Core 1.28-1.5GHz , MT6739

Operating System: Android 7.0、8.1

Basic Information: GSM 850/900/1800/1900

Screenr: Highest support HD+(1440*720),MIPI interface。

Module Size: 55.5*38.5*3mm

Pin Number: 146pin

Layers: 10 layers ENIG

Flash: 1+8、 2+16、3+32

Wi-Fi: IEEE 802.11 b/g/n, 2.4GHz/5GHz dual-band


Bluetooth: BT 4.0、3.0、 2.1 , support BLE

Introducing BGA (Ball Grid Array) Assembly services, the cutting-edge solution for precise and reliable assembly of complex electronic components. BGA Assembly involves the mounting and soldering of Ball Grid Array packages onto printed circuit boards, providing high-density interconnectivity and enhanced performance for advanced electronic systems.

At our advanced facility, we offer comprehensive BGA Assembly services to meet the demanding requirements of modern electronics. Our state-of-the-art equipment and skilled technicians ensure accurate placement, precise soldering, and meticulous quality control throughout the assembly process.

BGA Assembly is known for its ability to accommodate densely packed components, resulting in compact and efficient circuit designs. By utilizing an array of solder balls instead of traditional leads, BGA packages offer improved electrical performance, reduced signal noise, and enhanced thermal dissipation.

We specialize in handling various BGA types, including micro BGAs, fine-pitch BGAs, and large-scale BGAs, to cater to diverse application needs. Whether it’s consumer electronics, telecommunications, medical devices, or aerospace systems, our BGA services deliver precise and high-performance assemblies.

Advantages of BGA Assembly:

  1. High-Density Interconnectivity: BGA allows for densely packed components, enabling compact circuit designs and efficient use of PCB space.
  2. Enhanced Electrical Performance: BGA packages also offer improved electrical performance with reduced signal noise, shorter signal paths, and better impedance control.
  3. Efficient Thermal Dissipation: The ball grid array configuration facilitates efficient heat dissipation, preventing overheating and  also ensuring reliable operation of high-power components.
  4. Reliable Soldering Connections: BGA employs advanced techniques like reflow soldering and underfill encapsulation to ensure strong and reliable solder joints.
  5. Meticulous Quality Control: We conduct thorough inspection procedures, including X-ray inspection and also thermal profiling, to verify proper solder joint formation and ensure assembly integrity.


SMT capacity: 19 million points/day
Testing Equipment X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed Chip placement speed (at best conditions) 0.036 S/piece
Mounted Component Specifications Pasteable smallest package
Minimum device accuracy
IC type chip accuracy
Mounted PCB Specifications Substrate size
Substrate thickness
throw rate 1. Resistance-capacitance ratio 0.3%
2. IC type without throwing material
Board Type POP/common board/FPC/rigid-flex board/metal substrate
DIP daily production capacity
DIP plug-in production line 50000 points/day
DIP post welding production line 20000 points/day
DIP test production line 50000pcs PCBA/day
Assembly processing capability
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month
PCBA processing capability
project Mass processing capability Small batch processing capability
Number of layers (max) 2-18 20-30
Plate type FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet PTFE, PPO, PPE
Rogers,etc Teflon E-65, ect
Sheet mixing 4 layers – 6 layers 6th floor – 8th floor
biggest size 610mm X 1100mm /
Dimensional Accuracy ±0.13mm ±0.10mm
Plate thickness range 0.2mm–6.00mm 0.2mm–8.00mm
Thickness tolerance ( t≥0.8mm) ±8% ±5%
Thickness tolerance (t<0.8mm) ±10% ±8%
Media thickness 0.076mm–6.00mm 0.076mm–0.100mm
Minimum line width 0.10mm 0.075mm
Minimum spacing 0.10mm 0.075mm
Outer copper thickness 8.75um–175um 8.75um–280um
Inner layer copper thickness 17.5um–175um 0.15mm–0.25mm
Drilling hole diameter (mechanical drill) 0.25mm–6.00mm 0.15mm–0.25mm
Hole diameter (mechanical drill) 0.20mm–6.00mm 0.10mm–0.20mm
Hole Tolerance (Mechanical Drill) 0.05mm /
Hole tolerance (mechanical drill) 0.075mm 0.050mm
Laser Drilling Aperture 0.10mm 0.075mm
Plate thickness aperture ratio 10:1 12:1
Solder mask type Photosensitive green, yellow, black, purple, blue, ink /
Minimum Solder Mask Bridge Width 0.10mm 0.075mm
Minimum Solder Mask Isolation Ring 0.05mm 0.025mm
Plug hole diameter 0.25mm–0.60mm 0.60mm-0.80mm
Impedance tolerance ±10% ±5%
Surface treatment type Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board Immersion Tin, OSP

Automatic Solder Paste Printing Machine

AOI Optical Inspection

Smt High-Speed Placement Machine

Nitrogen Reflow Soldering


Three Anti-Paint Spraying Machine

SPI Solder Paste Thickness Tester

Automatic Wave Soldering Machine

First Article Inspection

Why choose us?
Efficient quotation

Our complete turnkey PCB assembly service provides a 24 hour quote service for your turnkey PCB assembly order.

All-round and reliable parts supplier

Leadsintec cooperates with world-renowned component suppliers to ensure that the source of electronic components is plastic and the authenticity is guaranteed.

Advanced equipment

It has 7 fully automatic SMT high-speed chip production lines, equipped with ten temperature zone nitrogen reflow ovens, online AOI, SPI, X-RAY and other equipment.

Quality assurance

We have complete ISO9001, ISO13485, ISO14001, IATF 16949, UL and other system certifications, and our products meet environmental protection requirements.

BGA Assembly FAQ
1. Do you undertake BGA rework?
Yes! You can rely on our BGA rework services to ensure optimum performance.
2. What is the test for BGA printed circuit board assembly?
For BGA printed circuit board assembly, we have strict testing protocols including: X-ray inspection, functional testing, automated optical inspection.
3. What are your BGA assembly capabilities?
Our BGA printed circuit board capabilities cover the following: Micro Ball Grid Array (µBGA), Thin Chip Array Ball Grid Array (CTBGA), Chip Array Ball Grid Array (CABGA), Ultra Thin Chip Array Ball Grid Array (CVBGA), Fine Pitch Ball Grid Array (VFBGA), Land Grid Array (LGA), Chip Scale Package (CSP), Wafer Level Chip Scale Package (WLCSP)
4. What are the factors that affect the quality of BGA assembly?
Some of the factors that affect BGA assembly quality include checking laminate compatibility, warpage requirements, surface finish effects, solder mask clearance, etc.
5. What is BGA assembly?
BGA or Ball Grid Array is a high density PCB packaging technology widely used in integrated circuits and is a popular surface mount package due to the precision component placement it provides.

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