Full Turnkey PCB Electronics – OEM & ODM Factory – Leadsintec
Name: Full Turnkey PCB Electronics – OEM & ODM Factory – Leadsintec
Origin: China
Certified: UL, CE, RoHS
Base Material: FR4, FR-4
Layer: 1-58 Layers
Surface finish: HASL/ lead-free HASL
Board thickness: customized
Solder mask color: Green, White
SMT DIP Turnkey PCB Assembly – Leadsintec
Name: SMT DIP Turnkey PCB Assembly – Leadsintec
Origin: china
Certified: UL, CE, RoHS
layer: 4 Layers
Material: FR-4
Finished Board Thickness: 1.6 mm
Surface finish: HASL/ lead-free HASL
Turnkey PCB SMT Manufacturer – Leadsintec
Turnkey PCB SMT Manufacturer – Leadsintec
Origin: China
Certified: UL, CE, RoHS
PCB layer: 1-32 layers
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards
Surface finish: ENIG/HASL/immersion Tin/ immersion Silver/ Hard Gold
Turnkey PCB Manufacturer OEM & ODM Electronics
Name: Turnkey PCB Manufacturer OEM & ODM Electronics
Layer Number: 2~64 Layers
Origin: china
Certified: UL, CE, RoHS
Copper Thickness: 0.5~6 OZ
Applications: New Energy, Automotive, Communications, Home Appliance, Consumer Electronics, Industrial Control, Security, AI, Transportation,
Medical, etc.
Turnkey PCB three Phase Charging Post for energy
Name: Turnkey PCB three Phase Charging Post for energy
Surface finish: ENIG/HASL/immersion Tin/ immersion Silver/ Hard Gold
Material: Shengyi/ Panasonic/ Durpont/TEQ/TAIFlex
Solder mask :green,blue, white, red, etc
Origin: china
Certified: UL, CE, RoHS
Fast Turnkey PCB Assembly IOT Security for Automobile
Name: Fast Turnkey PCB Assembly IOT Security for Automobile
Material:CEM-1, CEM-3, FR-4, Aluminum, Rogers, high Tg etc.
Origin: China
Certified: UL, CE, RoHS
Layer: 1-64 L
Board thickness: customized
Surface finish: HASL, OSP, Immersion Gold/Silver/Tin, ENIG, Gold Finger
Solder mask :green, blue, white, red, etc
- PCB Assembly Capability
- PCB Assembly Equipment
| SMT capacity: 19 million points/day | ||
| Testing Equipment | X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station | |
| Placement speed | Chip placement speed (at best conditions) 0.036 S/piece | |
| Mounted Component Specifications | Pasteable smallest package | |
| Minimum device accuracy | ||
| IC type chip accuracy | ||
| Mounted PCB Specifications | Substrate size | |
| Substrate thickness | ||
| throw rate | 1. Resistance-capacitance ratio 0.3% | |
| 2. IC type without throwing material | ||
| Board Type | POP/common board/FPC/rigid-flex board/metal substrate | |
| DIP daily production capacity | ||
| DIP plug-in production line | 50000 points/day | |
| DIP post welding production line | 20000 points/day | |
| DIP test production line | 50000pcs PCBA/day | |
| Assembly processing capability | ||
| The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month | ||
| PCBA processing capability | ||
| project | Mass processing capability | Small batch processing capability |
| Number of layers (max) | 2-18 | 20-30 |
| Plate type | FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet | PTFE, PPO, PPE |
| Rogers,etc Teflon | E-65, ect | |
| Sheet mixing | 4 layers – 6 layers | 6th floor – 8th floor |
| biggest size | 610mm X 1100mm | / |
| Dimensional Accuracy | ±0.13mm | ±0.10mm |
| Plate thickness range | 0.2mm–6.00mm | 0.2mm–8.00mm |
| Thickness tolerance ( t≥0.8mm) | ±8% | ±5% |
| Thickness tolerance (t＜0.8mm) | ±10% | ±8% |
| Media thickness | 0.076mm–6.00mm | 0.076mm–0.100mm |
| Minimum line width | 0.10mm | 0.075mm |
| Minimum spacing | 0.10mm | 0.075mm |
| Outer copper thickness | 8.75um–175um | 8.75um–280um |
| Inner layer copper thickness | 17.5um–175um | 0.15mm–0.25mm |
| Drilling hole diameter (mechanical drill) | 0.25mm–6.00mm | 0.15mm–0.25mm |
| Hole diameter (mechanical drill) | 0.20mm–6.00mm | 0.10mm–0.20mm |
| Hole Tolerance (Mechanical Drill) | 0.05mm | / |
| Hole tolerance (mechanical drill) | 0.075mm | 0.050mm |
| Laser Drilling Aperture | 0.10mm | 0.075mm |
| Plate thickness aperture ratio | 10：1 | 12：1 |
| Solder mask type | Photosensitive green, yellow, black, purple, blue, ink | / |
| Minimum Solder Mask Bridge Width | 0.10mm | 0.075mm |
| Minimum Solder Mask Isolation Ring | 0.05mm | 0.025mm |
| Plug hole diameter | 0.25mm–0.60mm | 0.60mm-0.80mm |
| Impedance tolerance | ±10% | ±5% |
| Surface treatment type | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board | Immersion Tin, OSP |
Automatic Solder Paste Printing Machine
AOI Optical Inspection
Smt High-Speed Placement Machine
Nitrogen Reflow Soldering
X-Ray
Three Anti-Paint Spraying Machine
SPI Solder Paste Thickness Tester
Automatic Wave Soldering Machine
First Article Inspection
Our complete turnkey PCB assembly service provides a 24 hour quote service for your turnkey PCB assembly order.
Leadsintec cooperates with world-renowned component suppliers to ensure that the source of electronic components is plastic and the authenticity is guaranteed.
It has 7 fully automatic SMT high-speed chip production lines, equipped with ten temperature zone nitrogen reflow ovens, online AOI, SPI, X-RAY and other equipment.
We have complete ISO9001, ISO13485, ISO14001, IATF 16949, UL and other system certifications, and our products meet environmental protection requirements.
