- PCB Assembly Capability
- PCB Assembly Equipment
The Energy Storage Module PCBA (Printed Circuit Board Assembly) is a specialized electronic assembly designed to provide efficient and reliable energy storage capabilities. It is a compact and integrated solution that combines a printed circuit board with energy storage components. This enables the storage and discharge of electrical energy as required.
The Energy Storage Module consists of a printed circuit board that serves as the foundation for the assembly. The PCB is designed with appropriate circuitry and traces to facilitate the flow of electrical energy within the module. It includes connectors, terminals, and mounting points for easy integration into larger energy storage systems or devices.
The PCBA incorporates energy storage components such as batteries, supercapacitors, or other energy storage devices. These components are carefully selected based on the specific application requirements, considering factors such as energy density, voltage range, charging and discharging capabilities, and cycle life.
Advantages of Energy Storage Module PCBA:
- Efficient Energy Storage: The Energy Storage PCBA provides an efficient means of storing electrical energy. Utilizing high-performance energy storage components, it also offers reliable energy storage capacity. This also allows for the accumulation of excess energy during periods of low demand or renewable energy generation.
- Compact and Integrated Design: The PCBA’s compact and integrated design enables space-efficient energy storage solutions. Integrating the necessary circuitry and components onto a single PCB. It also minimizes the footprint and simplifies the overall energy storage system design.
- Customizable for Various Applications: The Energy Storage Module PCBA can be customized to meet the requirements of various applications. The selection of energy storage components, circuit design, and PCB layout can be tailored to specific voltage ranges, energy capacity, discharge rates, and other application-specific parameters.
- Seamless Integration: The PCBA is designed to seamlessly integrate into larger energy storage systems or devices. It includes connectors and terminals for easy electrical connections. It also enables simple integration with other components, control systems, or power distribution systems.
- Reliable Performance and Safety: The Energy Storage Module PCBA undergoes rigorous testing and quality control processes to ensure reliable performance and safety. It incorporates protection mechanisms such as overcharge protection, and short-circuit prevention to safeguard the energy storage components and the overall system.
| SMT capacity: 19 million points/day | ||
| Testing Equipment | X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station | |
| Placement speed | Chip placement speed (at best conditions) 0.036 S/piece | |
| Mounted Component Specifications | Pasteable smallest package | |
| Minimum device accuracy | ||
| IC type chip accuracy | ||
| Mounted PCB Specifications | Substrate size | |
| Substrate thickness | ||
| throw rate | 1. Resistance-capacitance ratio 0.3% | |
| 2. IC type without throwing material | ||
| Board Type | POP/common board/FPC/rigid-flex board/metal substrate | |
| DIP daily production capacity | ||
| DIP plug-in production line | 50000 points/day | |
| DIP post welding production line | 20000 points/day | |
| DIP test production line | 50000pcs PCBA/day | |
| Assembly processing capability | ||
| The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month | ||
| PCBA processing capability | ||
| project | Mass processing capability | Small batch processing capability |
| Number of layers (max) | 2-18 | 20-30 |
| Plate type | FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet | PTFE, PPO, PPE |
| Rogers,etc Teflon | E-65, ect | |
| Sheet mixing | 4 layers – 6 layers | 6th floor – 8th floor |
| biggest size | 610mm X 1100mm | / |
| Dimensional Accuracy | ±0.13mm | ±0.10mm |
| Plate thickness range | 0.2mm–6.00mm | 0.2mm–8.00mm |
| Thickness tolerance ( t≥0.8mm) | ±8% | ±5% |
| Thickness tolerance (t＜0.8mm) | ±10% | ±8% |
| Media thickness | 0.076mm–6.00mm | 0.076mm–0.100mm |
| Minimum line width | 0.10mm | 0.075mm |
| Minimum spacing | 0.10mm | 0.075mm |
| Outer copper thickness | 8.75um–175um | 8.75um–280um |
| Inner layer copper thickness | 17.5um–175um | 0.15mm–0.25mm |
| Drilling hole diameter (mechanical drill) | 0.25mm–6.00mm | 0.15mm–0.25mm |
| Hole diameter (mechanical drill) | 0.20mm–6.00mm | 0.10mm–0.20mm |
| Hole Tolerance (Mechanical Drill) | 0.05mm | / |
| Hole tolerance (mechanical drill) | 0.075mm | 0.050mm |
| Laser Drilling Aperture | 0.10mm | 0.075mm |
| Plate thickness aperture ratio | 10：1 | 12：1 |
| Solder mask type | Photosensitive green, yellow, black, purple, blue, ink | / |
| Minimum Solder Mask Bridge Width | 0.10mm | 0.075mm |
| Minimum Solder Mask Isolation Ring | 0.05mm | 0.025mm |
| Plug hole diameter | 0.25mm–0.60mm | 0.60mm-0.80mm |
| Impedance tolerance | ±10% | ±5% |
| Surface treatment type | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board | Immersion Tin, OSP |
Automatic Solder Paste Printing Machine
AOI Optical Inspection
Smt High-Speed Placement Machine
Nitrogen Reflow Soldering
X-Ray
Three Anti-Paint Spraying Machine
SPI Solder Paste Thickness Tester
Automatic Wave Soldering Machine
First Article Inspection
