Rogers RO4003C High Frequency PCB Board

Rogers RO4003C High Frequency PCB Board

Name: Rogers RO4003C High Frequency PCB Board

Darkness: 3.38±0.04

Layers: 2 layers

Dielectric thickness: 0.508mm (20mil)

Finished thickness: 0.6mm

Material Copper Thickness: ½(17μm)

Finished copper thickness: 1OZ (35μm)

Surface treatment: Immersion silver

Applications: Communication infrastructure, computers, aerospace

Product Details Data Sheet

Rogers RO4003C High Frequency PCB Board material is a proprietary woven glass reinforced hydrocarbon/ceramic with the electrical properties of PTFE/woven glass and the manufacturability of epoxy/glass.

RO4003C laminates are available in a variety of configurations in 1080 and 1674 glass fabric styles, all conforming to the same laminate electrical performance specifications.

RO4003C laminates offer tightly controlled dielectric constant (Dk) and low loss while using the same processing methods as standard epoxy/glass, but at a fraction of the cost of traditional microwave laminates. Unlike PTFE-based microwave materials, no special through-hole processing or handling procedures are required.

RO4003C material is bromine free and does not meet UL 94 V-0 ratings. For applications or designs that require a UL 94 V-0 flammability rating, RO4835™ and RO4350B™ laminates do meet this requirement.

This PCB board enables efficient signal propagation with minimal signal attenuation, ensuring reliable and accurate data transmission. It provides exceptional electrical performance over a wide range of frequencies, allowing for optimal signal integrity and minimizing signal reflections.

The Rogers High Frequency PCB Board exhibits precise fabrication capabilities, enabling tight tolerance control and consistent impedance matching. This ensures accurate signal transmission, minimizing impedance discontinuities and optimizing overall system performance.

Feature of Rogers RO4003C High Frequency PCB Board

  • Dk is 3.38 +/- 0.05
  • 0.0027 dissipation factor at 10 GHz
  • Low Z-axis thermal expansion at 46 ppm/°C

Benefit

  • Ideal for multi-layer board (MLB) construction
  • Processes such as FR-4 are less expensive to manufacture
  • Designed for performance-sensitive high-volume applications
  • Competitive pricing

 

Also check our new product 8-layer 1-stage HDI rigid-flex board

Name: Rogers RO4003C High Frequency PCB Board

Darkness: 3.38±0.04

Layers: 2 layers

Dielectric thickness: 0.508mm (20mil)

Finished thickness: 0.6mm

Material Copper Thickness: ½(17μm)

Finished copper thickness: 1OZ (35μm)

Surface treatment: Immersion silver

Applications: Communication infrastructure, computers, aerospace

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