8-layer 1-stage HDI rigid-flex board

Introducing the 8-layer 1-stage HDI (High-Density Interconnect) Rigid-Flex Board, a cutting-edge solution designed for advanced electronic applications that require high-density interconnections, flexibility, and compact form factors. This rigid-flex board combines the benefits of rigid and flexible substrates. It also offers superior functionality and design flexibility.

The 8-layer 1-stage HDI Rigid-Flex Board features eight layers of circuitry, allowing for complex and compact designs. It employs advanced HDI technology, enabling high-density interconnections with smaller vias, finer traces, and tighter spacing between components. This results in improved signal integrity, reduced crosstalk, and also enhanced electrical performance.

At made-in-pcb, we have the ability to provide you with 8-layer rigid flex PCB and 4-layer rigid flex circuit board with a wide range of specifications. The surface treatment of this rigid-flex printed circuit board can choose HASL, immersion gold and OSP. The maximum panel size for the printed circuit boards we manufacture is 18″ x 24″. The surface finish used for this printed circuit board is HASL.

We offer you a choice of different solder mask colors such as green, red, blue, black, Taiyo PSR4000 white and white. You can also choose the legend/silkscreen from black or white.

We have the ability to provide you with 8-layer rigid-flex PCB and 4-layer rigid-flex PCB with board thickness ranging from 0.5 mm ~ 3.0 mm (0.02″~0.12″).

At made-in-pcb, we also always strive to provide our customers with the highest quality products and services, which helps us build trust among them. Our fully equipped facility enables us to design and manufacture 8-layer rigid flexible printed circuit boards to the highest industry standards.