RO4350B

RO4350B + FR4 high frequency hybrid PCB

Product name: RO4350B + FR4 high frequency hybrid plate

Plate: Rogers RO4350B+FR4

Layers: 4L

Board thickness: 1.2MM

Copper Thickness: 1OZ

Media thickness: 0.508mm

Dielectric Constant: 3.48

Thermal conductivity: 0.69w/m.k

Flame retardant grade: V-0

Volume resistivity: 1.2*1010

Surface resistivity: 5.7*109

Density: 1.9gm/cm3

Surface technology: chemical immersion gold

Application: communication instrument

Product Details Data Sheet

Introducing the RO4350B + FR4 High Frequency Hybrid PCB, a versatile and high-performance solution that combines the advantages of Rogers’ RO4350B high-frequency material with the cost-effectiveness of standard FR4 material. This hybrid PCB offers a balanced approach, providing optimal performance while keeping manufacturing costs in check.

The RO4350B + FR4 High Hybrid PCB is specifically designed for applications that require precise signal transmission, low signal loss, and cost efficiency.

By incorporating FR4 material in other areas of the board, the hybrid PCB achieves cost savings without compromising overall performance. FR4 material provides mechanical strength, stability, and ease of fabrication, making it suitable for non-critical areas of the PCB.

The hybrid construction of High Frequency Hybrid PCB offers excellent dimensional stability and precise fabrication capabilities. With tight tolerance control and consistent impedance matching, it enables accurate signal propagation, minimizing signal reflections and maximizing system performance.

The integration of material in critical areas of the board ensures excellent high-frequency characteristics. This also includes low-loss dielectric properties and low electrical loss tangent. This enables efficient signal propagation and minimal signal attenuation. This also makes it ideal for high-frequency circuits found in wireless communication systems, microwave circuits, and RF devices.

 

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Product name: RO4350B + FR4 high frequency hybrid plate

Plate: Rogers RO4350B+FR4

Layers: 4L

Board thickness: 1.2MM

Copper Thickness: 1OZ

Media thickness: 0.508mm

Dielectric Constant: 3.48

Thermal conductivity: 0.69w/m.k

Flame retardant grade: V-0

Volume resistivity: 1.2*1010

Surface resistivity: 5.7*109

Density: 1.9gm/cm3

Surface technology: chemical immersion gold

Application: communication instrument

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