Communication high frequency hybrid PCB

Introducing our Communication High Frequency Hybrid PCB, a versatile and efficient solution designed to meet the demanding requirements of communication systems operating at high frequencies. This hybrid PCB combines the benefits of high-frequency materials and standard FR4 materials. It also provides optimal performance and cost-effectiveness.

Our Communication High Frequency Hybrid PCB is specifically engineered for applications that require precise signal transmission, low signal loss, and cost efficiency. By leveraging high-frequency materials in critical areas of the board, we ensure efficient signal propagation. This also results in excellent signal integrity and reliable communication performance.

The integration of standard FR4 material in other areas of the PCB allows for cost savings without compromising overall functionality. FR4 offers good mechanical stability and ease of fabrication. This also makes it suitable for areas of the board that do not require high-frequency characteristics.

The Communication high frequency hybrid PCB includes a base plate, which is folded on the first inner wire layer. The first outer wire layer, and the top surface of the solder mask ink layer from bottom to top in order from top to bottom. The positioning circuit layer, the second outer wire layer, the bottom surface of the substrate. The second layer of solder resist ink layer, the substrate includes a high-frequency area and an auxiliary area. The auxiliary area is finally fixed, and also the inlay in the high-frequency area should be located at a fixed position.

The utility model provides a high-frequency hybrid splint, which is divided into two parts:

A high-frequency area and an auxiliary area. Provide mechanical support.