10-layer 1-stage HDI communication PCB

Name: 10-layer 1-stage HDI communication PCB

Layers: 1+8+1

Sheet: FR4 Tg170

Plate thickness: 1.2mm

Panel size: 110.8*94.8mm/4

Outer copper thickness: 35μm

Inner layer copper thickness: 18μm

Minimum through hole: 0.20mm

Minimum blind hole: 0.10mm

Minimum BGA: 0.20mm

Line width and line spacing: 2.5/2.2mil

Surface Treatment: Immersion Gold 2μ”+OSP

Application field: communication

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Product Details Data Sheet

The 10-Layer 1-Stage HDI Communication PCB is an advanced printed circuit board designed specifically for communication applications that require high-density interconnect (HDI) technology. It offers superior signal integrity, increased functionality, and enhanced reliability. This also makes it well-suited for use in telecommunications, networking, and other communication systems.

Technical features:

50 Ω Antenna, 90Ω & 100Ω Differential Impedance

Application of 10-layer 1-stage HDI communication PCB：

Cell Phones, Tablets, Ultrabooks, E-Readers, MP3 Players, GPS, Portable Game Consoles, DSCs, Cameras, LCD TVs, POS Terminals

HDI PCBs are widely used to reduce the weight and overall size of products, as well as improve the electrical performance of devices.

HDI PCBs also plays an important role in medical equipment as well as various electronic aircraft components. The possibilities for high-density interconnect 10-layer 1-stage communication PCB technology seem almost limitless.