Rigid Printed Circuit Boards

Small Rigid BGA circuit board

Name: Small BGA circuit board

Material: FR4 High TG

Finished plate thickness: 1.6mm

Surface treatment: Immersion Gold (ENIG)

Finished Copper Thickness: 1/1 oz inside and outside

Special Process:

BGA pad 0.1mm

Product Details Data Sheet

Introducing the Small Rigid BGA Circuit Board, a compact and high-performance solution designed for electronic applications that require advanced packaging technology and a small form factor. This small rigid BGA circuit board offers reliable interconnectivity for densely populated components and complex circuit designs. It also provides exceptional performance in a compact size.

Features: Small Rigid BGA circuit board

  1. High-Density Interconnect: The small BGA circuit board utilizes advanced BGA technology. This also allows for a high-density interconnection between the board and the components. Moreover, this enables efficient signal routing, power distribution, and thermal management in a small space, maximizing functionality and performance.
  2. Compact Form Factor: With its small form factor, this circuit board is perfect for applications where space is limited. It enables designers to create smaller and more compact electronic devices without compromising on functionality or performance. The small size opens up possibilities for innovative and portable designs.
  3. Robust Construction: The rigid substrate material provides mechanical stability and strength. This also ensures the secure mounting of BGA packages and other components. This robust construction enhances the durability and reliability of the circuit board, making it suitable for demanding environments.
  4. Advanced Packaging Technology: The incorporation of BGA technology allows for a more efficient and reliable connection between the board and the components. BGA packages provide improved electrical performance, increased pin density, and better heat dissipation, resulting in enhanced system performance and longevity.
  5. Customization Options: The small BGA circuit board can be customized to meet specific requirements, including the number and arrangement of BGA packages, number of layers, board thickness, and other design considerations. This flexibility allows for tailored solutions that precisely match the needs of various electronic applications.

Investing in the Small Rigid BGA Circuit Board ensures high-density interconnectivity, compactness, robustness, advanced packaging technology, and customization options. Benefit from its small form factor, superior performance, and reliability. This innovative circuit board empowers designers to create cutting-edge electronic devices for a wide range of industries and applications.

Name: Small BGA circuit board

Material: FR4 High TG

Finished plate thickness: 1.6mm

Surface treatment: Immersion Gold (ENIG)

Finished Copper Thickness: 1/1 oz inside and outside

Special Process:

BGA pad 0.1mm

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